Semiconductor Market Update - 2nd week of 2024
20240108
Nvidia and AMD are expected to ship 1.5 million AI chips from TSMC in 2024
Nvidia new products: B100, GB200
AMD's main AI accelerators: MI300A, MI300X (With the support of TSMC's production capacity, AMD's annual shipment momentum of AI acceleration chips is expected to reach 600,000 units in 2024.)
TSMC: expand its advanced packaging production capacity such as CoWoS
MFG of advanced chip packaging equipment are expected to see shipment momentum increase quarter by quarter in 2024.
Onsemi recently announced the launch of nine new EliteSiC power integrated modules (PIMs) that provide bidirectional charging capabilities for DC ultra-fast electric vehicle (EV) chargers and energy storage systems (ESS). The silicon carbide-based solutions will dramatically improve system cost with higher efficiency and simpler cooling mechanisms that can reduce size by up to 40% and weight by up to 52% compared to traditional silicon-based IGBT solutions. With more compact, lighter charging platforms, designers will have all the key building blocks that are needed to quickly deploy a reliable, efficient and scalable network of DC fast chargers that can charge electric vehicle batteries up to 80% in as little as 15 minutes.
20230109
TI launches new automotive chip to help automakers build smarter, safer cars
The AWR2544 77GHz millimeter-wave radar sensor chip is the industry’s first for satellite radar architectures, enabling higher levels of autonomy by improving sensor fusion and decision-making in ADAS. TI’s new software-programmable driver chips, the DRV3946-Q1 integrated contactor driver and DRV3901-Q1 integrated squib driver for pyro fuses, offer built-in diagnostics and support functional safety for battery management and powertrain systems. TI is demonstrating these new products at the 2024 Consumer Electronics Show (CES).
New Products: AWR2544, DRV3901-Q1 and DRV3946-Q1
Samsung plans to achieve full automation in fabs by 2030
Samsung Electronics has begun developing smart sensing systems aimed at changing the way semiconductor factories operate and increasing output. Samsung aims to have fully unmanned semiconductor production facilities by 2030.
20240110
Nexperia releases new LCD bias power IC to provide high performance for display devices.
Nexperia recently launched a new range of space-saving, high-efficiency, dual-output LCD bias supplies. These devices have been designed to extend the lifetime of thin film transistor liquid crystal display (TFT-LCD) panels used in various applications including smartphones, tablets, virtual reality (VR) headsets, and LCD modules.
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