DipcoVer, Circuit board warpage caused by factors such as heat, Solder fogging prevention inside the DIP tank, Circuit board jig
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- For when you want to control circuit board warpage caused by factors such as heat.
- For when you want to protect the circuit board from harm such as solder fogging and static electricity.
- For when you want to prevent circuit board strain in air reflow.
- For preventing mounter operation obstruction from harm such as circuit board warpage and deflection.
It is possible to use even when the insertion depth to the circuit board (B measurement) is shallow. In addition, this is effective when there are perforations for division.
This covers the pilot hole of the post attachment part near the edge surface of the circuit board. This is especially effective when the jet stream level gets higher and the size of the circuit board is 200mm or more.
This is optimal for the temporary protection of areas such as the circuit board card edge connector part (connector part) or the pilot hole cover of the onboard connector attached to the circuit board edge surface.
[For various types of small quantity production]
One of these can even support circuit boards with differences in configuration. It is possible to attach the weight spring any place you like with the center part M2 nut groove.
