二手 UEDA / CYBEQ IP 8000 #153732 待售
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ID: 153732
晶圓大小: 6" - 8"
CMP polishing tool, 6" - 8"
Designed to process up to (6) 6" / 8" wafers at once
Integrated head retraction system
Can be modified to include 4" / 5" wafers
At a polish setting of 1 minute:
Cycle time: 6.5 minutes
Throughput: 55 wafers per hour
Dual input wafer cassettes
Load side cassette nests are designed to tilt from 0 to 90°
Unload side cassette nests are open backed and remain at a constant 90° over (2) height adjustable DI water tanks
Each cassette can hold up to (25) 6" / 8" wafers
Each side holds (2) cassettes
Previous processes run: STI, ILD, BPSG, Tungsten (single step Cabot slurry and specific pad), Poly Silicon (addition of a heated platen from a closed loop M&W heater / chiller), silicon wafer reclaim
Wafer planarization of ~50 angstroms across surface of all wafers with a range between heads of <80
Edge exclusion of 3mm achievable
Specifications:
Polishing System:
Employs 3 degrees of motion: platen, carousel, and carriers, plus eccentric motion
Wafer Handling Capacity:
150 mm or 200 mm diameter (100/125mm possible)
2 Cybeq Articulated Robots
2 Head Loading Modules (HLMs)
Dual input and output cassettes
Wafer Carriers/Heads:
6 floating heads (patented design)
Programmable retracting heads allow 2 to 6 wafers per polishing cycle
Programmable speed from 1 to 30 rpm +/- 1%
Programmable uniform down force air pressure from 1 to 10 psi
Powered by a brushless servo motor
Wafer Cleaning:
Automated nozzle rinse with DI water after polishing
Automated low pressure DI water polishing/cleaning cycle after polishing
Platen:
36” diameter
Made of number 304 stainless steel
Polyurethane coated on exposed surfaces for acid based slurries
Programmable speed from 1 to 35 rpm
Programmable rotational direction, cw or ccw
Powered by a brushless servo motor
Optional temperature control unit
Carousel:
30” diameter
Made of anodized aluminium
Polyester-urethane coated on exposed surfaces
Programmable speed from 1 to 30 rpm
Programmable rotational direction, cw or ccw
Powered by a brushless servo motor
Pad Dresser:
Optional 4” or 12” diamond disc
Programmable speed from 1 to 30 rpm
Programmable down force from 0 to 200 lbs
Slurry:
Dual peristaltic pumps feeding through dual or separate PALL filters
System Control:
Microsoft Windows Graphical User Interface (GUI) with front and back TFT touch screen controllers/monitors
Multiple steps of unlimited polishing recipes
Siemens PLCs for motion control
Fully automatic or semi-automatic operation
Optionally SECSI, II, and GEM capable
Facility:
200 –240 VAC, 3 phase 50 – 60 Hz, 60 amps maximum, AC – line filter
CDA, 80-90 psi at 2 cfpm
Nitrogen, 60 psi at 2 cfpm
DI water, 2 to 4 gpm at 40 psi
Slurry, 2 x 1/2” inputs, minimum 12psi.
UEDA/CYBEQ IP 8000是一種先進的晶圓研磨、研磨和拋光設備,旨在提高生產率、精度和效率。它旨在用於設備技術、半導體基板和MEMS結構等一系列全面的應用。該系統采用集成硬件、軟件和自動化組件的創新設計,以簡化設置和操作。該裝置采用可調節的螺距、雙向磨輪,安裝在穩定的平臺上,以及可控的研磨拋光裝置。雙向輪可確保磨削均勻,而可調節的螺距輪可確保光滑甚至磨削和拋光。UEDA IP 8000能夠研磨、研磨和拋光直徑不超過3英寸的晶片,厚度在25到200 μ m之間。它還提供了對研磨參數(如速度和壓力)以及研磨和拋光力和介質進料速率的精確、自動化控制。此外,該機還具有可調節的切削深度特性,可自動微調磨削速率。此工具專為高端用戶而設計,具有多種數據輸入和輸出功能,確保順利一致地集成到生產線中。它還提供了門互鎖等多種安全特性,以及調制研磨研磨設備速度和受力的能力,最大限度地減少對晶片的潛在損害。CYBEQ IP 8000具有卓越的精確度,能夠提供高質量、均勻的飾面。在為高端用戶設計的同時,這一資產也適用於廣泛的應用,容易融入現有生產線。該型號采用自動化集成設計,是尋求高效可靠晶圓研磨、研磨和拋光設備的理想選擇。
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